Electronics

 Processes for SAP･MSAP

ApplicationPropertiesProcess Name
Inner-layer Copper / Circuit Formation PretreatmentEtching agent for roughenining the copper surface prior to circuit formationNBS II
Lamination PretreatmentImproves adhesion by roughening the copper surface prior to laminationNBD II
Copper Layer Thinning TreatmentHalf-etchHE-500
Direct Lazer PretreatmentSulfuric Acid / Hydrogen Peroxide surface treatment agent for direct CO2 lazer processingNBDL
Direct Lazer After-treatmentSulfuric Acid / Hydrogen Peroxide Etching agent to remove splash and copper burr during copper direct via formationSPDL
From desmear to electroless copper (PTH) processesHigh adhesion with low profile processesFEED
DFR PretreatmentHigh adhesion with low profile processesNA (Development)
Copper roughening processNBS II
DFR RemovalPlasma equipment to descumTAIKAI
Copper PretreatmentAcidic cleanerPB-242D, PB-268
Via Filling Copper PlatingVia filling processCU-BRITE VF5
Via filling processCU-BRITE VL
Via filling processCU-BRITE VH
* Additional products for other applications also available
Through-hole Filling Copper PlatingThrough-hole fillingCU-BRITE TF II
High-Throwing Power Copper PlatingConformal platingCU-BRITE VT28
Conformal platingCU-BRITE 21
DFR RemovalNon-caustic processRS-81
SAP Circuit FormationSelective etching for electroless copperSAC
MSAP Circuit FormationSelective etching for circuit spacingFE-830 II
SR PretreatmentImproves adhesion by roughening the copper surface prior to laminationNBD II
SR Residue RemovalPlasma equipment to remove SR residueTAIKAI
Palladium Residue RemovalCyanide-free palladium removal processFINELESE
Noble Metal PlatingENEPIG/ENIGSKYLITE
Multilayer / HDI Processes

Multilayer / HDI Processes

ApplicationPropertiesProcess Name
Inner-layer Copper / Circuit Formation PretreatmentEtching agent for roughenining the copper surface prior to circuit formationNBS II
Lamination PretreatmentImproves adhesion by roughening the copper surface prior to laminationNBD II
Copper Layer Thinning TreatmentHalf-etchHE-500
From desmear to electroless copperGeneral purpose processLAIZATRON
DesmearPlasma equipment process to desmearTAIKAI
Copper PretreatmentAcidic cleanerPB-242D, PB-268
High-Throwing Power Copper PlatingConformal platingCU-BRITE 21
Via Filling Copper PlatingVia filling processCU-BRITE VF II
Via filling processCU-BRITE MW
Noble Metal PlatingElectrolytic Ni-Au, Electroless Ni-AuSKYLITE

FPC / Process for Special Materials

ApplicationPropertiesProcess Name
Electroless Nickel Seed Layer FormationPolyimide high adhesion processesELFSEED
Electroless Plating for Special MaterialsApplication for COP as well as other materialsAISL
Pd-Sn direct platingProcesses especially for polyimide conductionLAIZATRON DPS
Copper Pattern PlatingFlattens top of copper traces and padsCU-BRITE RF
Copper Panel PlatingOptimal for low internal stress, R to R plating among othersCU-BRITE TH-R III
Surface TreatmentDFR pre-treatment, gold plating pre-treatmentSA, SI
Noble Metal PlatingElectrolytic Ni-Au and Electroless Ni-Au useSKYLITE
Seed Layer RemovalDissolves sputtered seed metal (Ni-Cr) on polyimide while suppressing copper dissolutionSEEDLON

Pretreatment Process

ApplicationPropertiesProcess Name
Immersion CleaningNeutral, low foaming, non-chelateIC-120
Electrolysis CleaningAlkaline non-chelateIC-200RM
EtchingCopper and copper-alloy use, immersion type, halogen-freeIC-320
42 Alloy use, immersion type, halogen-freeIC-313N
Corson alloy use, electrolytic type, halogen-freeCA-40P

Plating Process

ApplicationPropertiesProcess Name
Tin Plating (Semi-bright)Alkane sulfonic acid bath, barrel or rack useHS-220S
Sulfuric acid bath, rack useRS-26
Alkane sulfonic acid bath, whisker suppresant effect, barrel or rack useUT-55 II
Alkane sulfonic acid bath, whisker suppressant, high electrical current density, rack useUT-55HD II
Tin-Copper Alloy (Semi-bright)Alkane sulfonic acid bath, non-chelate, high electrical current density, rack useSE II
Alkane sulfonic acid bath, non-chelate, barrel useSE-BL II
High Throwing Power ProcessHigh throwing power, optimal for high precision partsSONIX

IC Lead Frame use, whisker suppression, tin plating process (WHISKER BUSTER)

ApplicationPropertiesProcess Name
Alkali Electrolysis degreaserOptimization of WB-300, non-chelate, low foamingWB-200
EtchingEtching agent used for the Whisker Buster Process Removes the modified and oxidized layer to provide a smooth surfaceWB-300
Semi-bright TinAlkane sulfonic acid bath Provides a fine, uniform appearance in a wide range of current density areas Excellent throwing power and whisker suppressantWB-500(HD)
Color Shift PreventionReduces deterioration in solder wettability Excellent in preventing tarnishingWB-900

Equipment Cleaning

ApplicationPropertiesProcess Name
Tin, Tin-Lead AlloyElectrolysis type, low foaming, low sludge, optimum for rackless equipmentIC-461
Tin-Silver AlloyImmersion type, low smut after strippingSA-10T
Tin-Bismuth Alloy Electrolysis type, low sludge, optimal for rackless equipmentIC-462
Tin, Tin-Copper AlloyImmersion typeST-401NC

Part Stripping

ApplicationPropertiesProcess Name
Tin, Tin-Silver AlloyImmersion type, fluoride-freeSA-421

Discoloration Prevention Process

ApplicationPropertiesProcess Name
Tin, Tin-alloyMore effective than sodium phosphoric acid, prevents solder deteriorationS-50

Copper Sulfate Plating

ApplicationPropertiesProcess Name
Fine Line/Cu BumpMatte type, maintenance is achievable with one additive, sulfur freeXP-CS
Re-wiring/Cu BumpFlattens the top of bumps, bright typeCU-BRITE BU II

Tin Plating

ApplicationPropertiesProcess Name
Tin Bump Easy bath maintenance EBASOLDER BU II

Nickel Plating

ApplicationPropertiesProcess Name
Barrier LayerLow stress, great physical propertiesBNI

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