Cleaning
| Application | Properties | Process Name |
|---|---|---|
| Alkali Immersion Degreaser | Iron and steel substrate use; non-chelate | SK-113 |
| Iron and steel, copper, copper alloy use; aggressive cleaning agent | SK-18 | |
| Steel substrate use, non-foaming, non-chelate degreaser; can be used with spray configurations | SK-18P | |
| Use with all metals, non-chelate, low-phosphorus, low silicate | SK-17 | |
| Use with all metals except magnesium | SK-144 | |
| All metals and plastic use, trichloroethylene substitutive cleaning | SK-1000 | |
| Use with all metals, removes buffing residue, strong osmotic force | SK-13 | |
| Use with all metals, removes buffing residue, non-phosphorus, neutral pH, can be used at low temperatures | SK-11 | |
| Aluminum and aluminum alloy use | AS-165F | |
| * Additional products for other applications also available | ||
| Alkali Electrolytic Degreaser | Iron and steel substrate heavy duty cleaner for both anodes and cathodes; non-chelate | E-223 |
| Non-foaming version of E-223 | E-223 S | |
| Best for Zn diecast substrates, to be used on Non-ferrous metals, used on anodes; non-chelate | E-221 | |
| Non-foaming version of E-221 | E-221 S | |
| Removes Iron and steel scaling, smut, and buffing residue; can be used on both cathodes and anodes, PR electrolysis; non-phosphorus | E-22 | |
| Iron and steel use, best for reapplying Ni plate; can be used for cathodes, anodes, and PR electrolysis; non-phosphorus | E-23 | |
| Iron and steel use, best used in the first degreasing step; can be used on anodes and PR electrolysis | E-27 | |
| Non-chelate version of E-27 | E-27 NC | |
| Low-foaming version of E-27 | E-27 K | |
| Non-foaming version of E-27 | E-27 SP | |
| * Additional products for other applications also available | ||
| Acid Cleaners (Immersion) | Iron and steel, copper, and copper alloy degreaser; derusting capabilities and highly effective at inhibiting etching smut | AC-51 |
| Acid Cleaners (Electrolytic) | Iron and steel electrolytic cleaner, removes scaling and heavy rusting, for use on cathode | AC-55 |
| AC-55 version containing Fluoride | AC-55 P | |
| Most suitable for degreasing before Zinc plating | AC-556 ZN | |
| * Additional products for other applications also available | ||
| Specialty Additives for Cleaners | Acid/Alkali cleaner mist reduction | F-90 |
| Alkali cleaner foam prevention | F-91 | |
| Electrolytic alkali cleaner scaling and smut remover | EF-901 |
Material Polishing
| Application | Properties | Process Name |
|---|---|---|
| Chemical Polishing | Copper, copper alloy, sulfuric acid based for easy wastewater treatment | CHP-200X |
| Copper, Copper Alloy Scaling Removal | CHP-240 | |
| Electrolytic Rack Stripper | Designed for stripping copper, nickel, chrome, and other plating residue from stainless steel clamps/hooks on racks | ST-42W |
Activation
| Application | Properties | Process Name |
|---|---|---|
| Acid Activation | Most suitable for steel, copper, copper alloy, nickel regenerative plating, brass containing lead | V-34C |
| Use with all metals | V-345 | |
| Low-bubbling version of V-345 | V-345LF | |
| Fluoride free version of V-345 | V-345NF | |
| * Additional products for other applications also available |
Release Agents
| Application | Properties | Process Name |
|---|---|---|
| Electrolytic Rack Stripper | Designed for stripping copper, nickel, chrome, and other plating residue from stainless steel clamps/hooks on racks | ST-42W |
| Non-amine based stripper for easy wastewater treatment; for stainless steel points of contact on rack, low electrolytic corrosion | ST-420 | |
| Substrate / Part Stripper | Strips nickel and nickel alloys from iron substrate; non-cyanide; non-ammonia | ST-41 |
| Strips nickel plating from iron substrate, one additive | ST-410 | |
| Nickel stripper used on copper, copper alloy substrates; non-cyanide; non-ammonia | ST-456 | |
| Electroless nickel stripping on Iron, copper, and copper alloy substrates with little effect on the substrate | ENIPAC HS | |
Copper Plating
| Application | Properties | Process Name |
|---|---|---|
| Cyanide Bath | Fine crystals provide a great bright finish | C-Brite |
| Decorative Copper Sulfate Bath | Easy to control, with capabilities of operating at a high current density and a wide temperature range | CU-BRITE EP-30 |
| Great leveling and bright finish | CU-BRITE #1A | |
| Can be used in high-speed applications, capable of plating over a wide variety of current densities | CU-BRITE HS | |
| * Additional products for other applications also available | ||
| Cylinder Plating | High Current Density Capabilities (20ASD) | CU-BRITE R-1 |
| Copper Sulfate | Capable of handling high temperatures (above 40℃) | CU-BRITE AR |
| Soft plate layer (Hv100-140) | CU-SOFT |
Nickel Plating
| Application | Properties | Process Name |
|---|---|---|
| Semi-bright Nickel | For use before multi-layer nickel on steel substrates; high leveling and adhesion, only one replenishing additive | CF-1 |
| For use on steel and plastic substrates before multi-layered nickel plating; formalin free with excellent physical properties | CF-24T | |
| For use on steel and zinc diecast substrates prior to multi-layer nickel plating; excellent anti-corrosive and physical properties | NS | |
| Low internal stress version of NS | NS-N | |
| * Additional products for other applications also available | ||
| Bright Nickel (Barrel Type) | Metal substrate use, soft bright finish, low stress, great physical properties, great adhesion, requires only one replenishing additive | NL-BL |
| Metal substrate use, offers great throwing power, requires only one replenishing additive | HI-BRITE BL | |
| Metal substrate use, has great throwing power, fabrication friendly, requires only one replenishing additive | PK-02BL | |
| Achieves a high bright finish in short plating time on Zinc-diecast substrates | PK-03BL | |
| Bright Nickel (Rack Type) | Can be used on all substrates, great physical properties, high tolerance to impurities | ＃88 |
| Shares characteristics of #88, but for zinc diecast substrates | ＃88-J | |
| Has great physical properties and is able to achieve strong results with a variety of brightness at high current densities | ＃88-HS | |
| Excellent bright finish and leveling with a dark tinted appearance | ＃88-SS | |
| Can be used on all substrates with easy maintenance due to one additive replenishing | HI-BRITE Z | |
| * Additional products for other applications also available | ||
| Super Bright (Rack Type) | Metal substrate use, extraordinary throwing power for chrome plating, requires only one replenishing additive | PK-SUPER |
| Metal substrate use, excellent throwing power, tolerant to zinc impurities | PK-FM | |
| Metal substrate use, offering great leveling and has a dark mirror finish | PK-EXCEL | |
| * Additional products for other applications also available | ||
| Low Leveling | Bright Ni with limited leveling control, closely following the shape of the substrate | COMBRITE NL TYPE II |
| Satin Nickel | A highly corrosive resistant satin finish with an excellent uniform appearance | SATIN-NI TYPE Ⅰ |
| Offers the same benefits of TYPE I with a brighter finish | SATIN-NI TYPE Ⅱ | |
| Black Nickel | Achieves a uniform black appearance over a wide range of current densities | Black Nickel GT |
| PTFE Complex Nickel | Offers PTFE uniformity within electrolytic plate layer through eutectoid reaction, high water resistance, and great release properties | TEFSITE TF |
Nickel Auxiliary Additives
| Application | Properties | Process Name |
|---|---|---|
| Regulating Agent | Adjusts carrier leveler in all bright nickel plating processes | AJ-4 |
| Regulates bright nickel leveling | # 119 | |
| Reinforces leveling ability for #81 and #88-HS processes | # 81-T | |
| Reduces semi-bright nickel plate stress | CARRIER SR | |
| Wetting Agent | Reduces surface tension and protects against pitting with low foaming | # 82 |
| Higher wettability than #82 | # 82-A | |
| Great at preserving wettability when moving from bath to bath | # 82-K | |
| Impurity Removal | Dissolution type chemical that removes metal impurities, particulary copper | CU-SHUT 2 |
| Eutectic type chemical that removes metal impurities from bath, particularly copper | CU-SHUT 3 | |
| Prevents skipping in areas of low current, limits the negative effects of Zn impurities; for use with PK series | PK-999 | |
| Eliminates the adverse effect of organic impurities in bright nickel plating bath | Purifier PN II | |
| Controls the negative effects of both metal and organic impurities | EBASHUT 33L |
Chrome Plating
| Application | Properties | Process Name |
|---|---|---|
| Bright Chrome | Excellent throwing power, strong activation, staining prevention; liquid type | E-300 |
| Black Chrome | Uniform black appearance with great anti-corrosion and anti-abrasion properties | NE |
| A uniform black appearance is achievable in a short amount of time with excellent anti-corrosive and anti-abbrasion properties | B-400 | |
| Hard Chrome | High current efficiency and a hard plate layer; non-fluoride | JCR-1000 |
Chrome Plating Regulating Agent
| Application | Properties | Process Name |
|---|---|---|
| Mist Prevention | PFOS free, stops mist and reduces dragout | MISTSHUT NP |
Electrolytic Chromate
| Application | Properties | Process Name |
|---|---|---|
| Electrolytic Chromate | Preserves appearance of stainless steel and plated substrates while improving anti-corrosive properties | E-500 |
Electroless Nickel
| Application | Properties | Process Name |
|---|---|---|
| Ni-P/For Use on Metals (Batch Type) | Lead free, high deposition speed and excellent bright finish | PHR II |
| Ni-P/For Use on Metals (Continuous Type) | Lead free, little decline in appearance quality with aging bath, excellent plating properties | ECOLTY CORE |
| Lead free, high phosphorus type; phosphorus is stabilized at 12% | ECOLTY CORE GT | |
| Ni-B/For Use on Metals | High hardness level | BN II |
| PTFE Complexing Bath for use on Metals | Lead and fluoride surfactant free, anti-abrasion, low friction coefficient | ECOLTY TEF |
| Fluoride surfactant free, water repellent, oil repellent | GRANLUBE 850 |
Electroless Nickel
| Application | Properties | Process Name |
|---|---|---|
| Catalyst | Activated prior to electroless nickel plating on copper or copper alloys substrates (Pd deposition) | CTS |
Anti-Corrosion Additives
| Application | Properties | Process Name |
|---|---|---|
| Neutral anti-rust | F-11 | |
| Water Soluble | Neutral anti-rust | F-93 |
| Anti-rust | Low alkali anti-rust, also optimal for pipe interiors | F-93N |
| Low alkali type, color change prevention | G-800 | |
| Alkali type, good for use with low current thin plating such as barrel plating | G-860 | |
| Oil Based Anti-rust | For all metals, very thin soft coating, water repellant oil | FARKAS-140 |
Zinc Plating
| Application | Properties | Process Name |
|---|---|---|
| Cyanide Bath | Bright finish with excellent throwing power, rack use | S-80 |
| Bright finish which can be used in high temperatures with low additive consumption, barrel use | S-200BL | |
| Can be used in high temperatures, excellent outward appearance on low current parts, rack and barrel use | S-300 | |
| Zincate bath | Effective throwing power, rack and barrel use | DIMENSION |
| Excellent outward appearance, rack and barrel use | ELZ-77 | |
| Acid bath | Ammonium chloride and potassium chloride type, excellent physical properties, rack and barrel use | EMZ-1200 |
| EMZ-1200 Low cost type | EMZ-1200 II | |
| Ammonium chloride bath, easy to use and maintain, rack and barrel use | EMZ-8000 |
Trivalent Chrome Process
| Application | Properties | Process Name |
|---|---|---|
| Bright Finish Conversion Coating | Uniform, strong blue to yellow tint, excellent adhesion and corrosion resistance | TRIVALENT 300 |
| Colored Finish | Uniform and strong yellow appearance, excellent heat and corrosion resistance, intended for barrel plating | TRIVALENT 400 |
| Blueish color, heat and corrosion resistant, single additive type | TRIVALENT 600 | |
| Black Finish | Uniform black color, better corrosion resistance than hexavalent chrome conversion coating | TRIVALENT 1100 |
Zinc Plating Special Additives and Conditioning
| Application | Properties | Process Name |
|---|---|---|
| Finishing Agent | Finishing agent intended exclusively for Trivalent 1100 Improves brightness and corrosion resistance and prevents unevenness in drying | TRIVALENT BKF II |
| Electrolyte Assistant | Controls ferrous impurities | TRIVALENT FC |
| Non-soluble coating | Hybrid type of organic and non-organic, excellent black color and corrosion resistance | JN COAT VW |
| Water-soluble Coating | Hybrid type of organic and non organic, thin film coating agent, black color available | JN COAT AC |
| Non-organic type, thick film coating agent, excellent anti-rust performance on zinc alloy | JN COAT 1710 | |
| Non-silica type, zinc alloy, excellent adhesion | G-660 |
Alloy Plating
| Application | Properties | Process Name |
|---|---|---|
| Iron Nickel Alloy | Iron use, high leveling, good with secondary manufacturing | FERROALLOY |
| Zinc Ni Alloy | Three times greater heat and corrosion resistance than common zinc plating, hydrogen brittleness is low | ZIN-LOY |
| Zinc Cobalt Iron | Excellent corrosion resistance against sulfurous acid gas, black chromate can be used | ZCF |
| Tin Cobalt | Color is similar to hexavalent chrome, pyrophosphoric acid bath, rack or barrel use | SNC |
| Black color, pyrophosphoric acid bath, rack and barrel use | SNC-BLACK | |
| Tetra tin salt, especially stable, rack and barrel use | TETRA SC | |
| Tin Nickel | Unique reddish tint, pyrophosphoric acid bath, rack and barrel use | SNI |
| Red-black color, pyrophosphoric acid bath, rack and barrel use | SNI #2-BLACK |
1. Electroless Nickel Process
Pretreatment
| Application | Properties | Process Name |
|---|---|---|
| Degrease | Has the two functions of removing distortions in plastic molding and removing grease and dirt | ENILLEX PC-5 |
| Wetting Agent | Prevents unevenness in chromic acid etching caused by air pockets | ENILLEX WE |
| Pre-Etching | Additive for use with PC resin, pre-etching | ENILLEX PE-200 |
| Additive for use with PC/ABS resin, pre-etching | ENILLEX PE-300 | |
| Neutralizer | Reduces hexavalent chrome and prevents its adverse effects | ENILLEX RD II |
| Activator | Used as an activator for difficult to plate plastics such as Noryl | ENILLEX NW |
| Catalyzer | Provides a palladium catalyzer over plastic with excellent palladium absorption | ENILLEX CT-304 |
| Provides palladium catalyzer over plastic, high tin-concentration | ENILLEX CT-580 |
Conduction
| Application | Properties | Process Name |
|---|---|---|
| Electroless Nickel | Concentrated solution lead free type, smooth and uniform film with good adhesion | ENILEX NI-5 |
| Smooth and uniform film, bath maintenance by automatic equipment is recommended | ENILEX NI-100 |
Copper Sulfate Pretreatment
| Application | Properties | Process Name |
|---|---|---|
| Copper Substitution | Intended for activation of electroless nickel plating film | ACTIVATOR PDC |
| Copper Strike | Improves appearance and electrodeposition after electroless nickel | CU STRIKE |
2. Direct Plating Process
Pretreatment and Processing
| Application | Properties | Process Name |
|---|---|---|
| Resin Surface Treatment | Improves leveling and throwing power of resin surface, improves the absorption effect of catalyst and deposition of metals | D-POP EA |
| Catalyst Absorption Accelerant | Enhances the effect of absorption of catalyst on resin such as polycarbonate alloy, etc. on which the effect is weak in normal process | D-POP CD |
| Catalyst Assistant | Deposits palladium catalyst on resin surface, has excellent absorption effect | D-POP ACT |
| Conduction Process | Forms a uniform conductive film on the resin surface, excellent stability | D-POP ME |
3. Plating Process
Copper Plating
| Application | Properties | Process Name |
|---|---|---|
| Bright Copper Sulfate Plating | Excellent nickel adhesion and physical properties | CU-BRITE EP |
| For metal substrates and plastic in general, has excellent brightness and leveling in a wide range, allows high temps and high current density operation | CU-BRITE EP-30 |
Nickel Plating
| Application | Properties | Process Name |
|---|---|---|
| Semi-bright | For multi-layer nickel undercoating on plastic substrate, formalin free, excellent physical properties and few cracks | CF-24 |
| For multi-layer nickel undercoating on plastic substrate, formalin free, brightener decomposition remains low even if insoluble anode is used | CF-24T | |
| Bright | Suited for the "new microporous chrome plating system," high corrosion resistant Ni-Cr plating | #77 |
| High electrical current, high brightness, and high physical properties | #88-HS | |
| Catalog Semi Bright Nickel | For multi-layer nickel undercoating on plastic substrate, formalin free, single solution type | BLS |
| Catalog Semi Bright Nickel | For multi-layer nickel undercoating on plastic substrate, has excellent leveling and ductility, single solution type | 909S |
Special Nickel Plating
| Application | Properties | Process Name |
|---|---|---|
| Tri-Strike | Significantly improves corrosion resistance by providing a nickel strike deposit between semi-bright and bright nickel layers | TR-STRIKE |
| Microporous Ni (MP-Ni) | Microporous chrome plating. A special nickel strike process to obtain high corrosion resistance on bright nickel film, uniform pore count | MP-NI 308 |
| Microporous chrome plating Intended for the same application as MP-Ni 308. Adequate pore number can be obtained if low powder concentration is used | MP-NI 309 |
Nickel Supporting Agents
| Application | Properties | Process Name |
|---|---|---|
| Adjusting Agents | Adjusts carrier leveler in all bright nickel plating processes | AJ-4 |
| Improves corrosion resistance of plated film by shifting the electric potential, which is measured by step test, to nobler | ELECTRICAL POTENTIAL ADJUSTMENT E | |
| Wetting Agents | Reduces surface tension and protects against pitting with low foaming | #82 |
| More wetting than #82 | #82-A | |
| Intended for all the types of nickel plating bath Assures good wettability during transfer | #82-K | |
| Impurity Prevention Agents | Removes metal impurities in nickel plating bath Especially good at removing copper components by co-deposition into the film | CU-SHUT 3 |
| Eliminates the adverse effect of organic impurities in bright nickel plating bath | Purifier PN II | |
| Controls impurities such as metals and inorganic materials | EBASHOT 33L |
Chrome Plating
| Application | Properties | Process Name |
|---|---|---|
| Bright | Excellent throwing power and activation, effective in preventing staining, liquid type | E-300 |